centre themes
packaging & integration

• Matching packaging technologies to volume demand, ensuring cost, quality and resilience for all levels of packaging – chip, system-on-chip (insert), module level (e.g. wirebonds, flip chip), chassis to chassis (cable, flex or wireless);
  For instance, in the design of antennae structures and dielectric builds for robust wireless communications;
• Matching design partitioning of functionality onto components / chipsets selection and packages for cost, size and compatibility;
  An example is the low-cost integration of packaging solutions with current manufacturing processes, e.g. placement and interconnection of chips within PCB during fabrication requires assembly and joining processes not normally found at a PCB fabricators facility;
• Determining assembly methodologies compatible with the surrounding product matrix for interconnections that will need to be robust to withstand any subsequent processes.
• High yields at all stages since encapsulation (e.g. overmoulding, ultrasonic lamination) or sealing within an enclosure can lead to difficulty in reworking;
• Reliability and resilience of packaging and interconnection solutions for the end-use lifetime.
• Development of advanced packaging at wafer level and for 3D interconnects, which is critical for enabling higher integration, new design freedoms, smaller device footprint, lighter products, reduced signal inductance and higher I/O density;
• Materials for thermal matching, novel materials, Cu vs Ag (i.e., resource efficiency).

exemplars of PhD projects with a focus in this area included:

• Christos Kouppas co-sponsored by Motion Robotics Ltd "Bi-Pedal Robots whose limbs can be moved at high speed designed with Motion Robotics Flexmotor actuator"
• Adam Kaye co-sponsored by Printed Electronics Ltd "Ink-Jet Printing Antennas on 3D Curved Surfaces"
• Adrian Ayastui co-sponsored by Moredun Ltd "Smart Sensors for Detection of Lack of Appetite in Cattle"
• Tobias Reichold co-sponsored by Renishaw plc "High-speed micro 3D metrology"