Reliability Engineering for Electronic Packaging 2017
11 December 2017
Cohort 3 researcher Youssef Hamid recently attended Reliability Engineering for Electronic Packaging (RELPACK 2017) organised by IMAPS. He write, the day was hosted by Daresbury laboratories and consisted of presentations, tutorials and a number of exhibitors. Topic areas presented included, material design for harsh environments, the use of computational modelling to illustrate failure and the use of design of experiments for qualitative accelerated life testing. Also presented was the different ways to mimic end use when investigating reliability testing of wearables. I attended RELPACK specifically because I was looking for an overview of packaging techniques such as BGA / Flip Chip technology / wire bonding. I got to meet Prof Chris Bailey from Greenwich University and Dr. Colin Johnson from Oxford University, which could bridge possible collaborations. From the industrial perspective, I met with Ville Hevonkorpi from Primoceler in Finland whose work is of great interest. Ville presented his work novel hermetic glass packaging for demanding applications and provided some amazing examples of the manufacturing services and reliability validation.
Summary of RELPACK 2017 written by Keith Arber, Bassem Mouawad, Chris Powley & Stephen Riches.
